C7025 brass plate is a high-performance copper-nickel-silicon alloy that delivers an excellent balance of strength and conductivity, with tensile strength up to 800 MPa and electrical conductivity of about 40% IACS, making it ideal for high-reliability electronic connectors, springs, and semiconductor lead frames.
Product Parameters
|
Parameter Category |
Typical Value / Range |
|
Alloy Designation |
C7025 (Cu–Ni–Si alloy) |
|
Density |
8.9 g/cm³ |
|
Electrical Conductivity |
Approx. 38–42 % IACS |
|
Tensile Strength (σᵦ) |
690–800 MPa (after aging) |
|
Yield Strength (σ₀.₂) |
480–600 MPa |
|
Elongation (A₅) |
6–12 % |
|
Hardness (HV) |
180–230 HV |
|
Thermal Conductivity |
Approx. 210 W/(m·K) |
|
Coefficient of Thermal Expansion |
17.6 × 10⁻⁶ / °C |
|
Operating Temperature Range |
Up to 150 °C (continuous) |
|
Thickness Range |
0.15 mm – 5 mm (custom available) |
|
Width / Length |
Customizable per order |
|
Surface Finish |
Bright, smooth, polished, or mill finish |
Chemical Composition
|
Species(Species)\Chemical compositionChemical |
Cu |
Fe |
Pb |
Ni |
Zn |
|
H65(C2680) |
63.5-68 |
≤0.10 |
≤0.03 |
≤0.5 |
Bal |
|
H68(C2620) |
67.0-70.0 |
≤0.10 |
≤0.03 |
≤0.5 |
Bal |
|
H70(C2600) |
68.5-71.5 |
≤0.10 |
≤0.03 |
≤0.5 |
Bal |
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