Product Parameters
|
Parameter Category |
Typical Value / Range |
|
Alloy Grade / Designation |
H65 (≈ CuZn35, C27000) |
|
Chemical Composition |
Cu: ~ 63.0–68.5 %, Zn: balance; |
|
Density |
≈ 8.47 g/cm³ |
|
Thermal Conductivity |
~ 140.2 – 141.7 W/(m·K) |
|
Electrical Conductivity |
≈ 32 % IACS |
|
Melting Range |
~ 966 – 1001 °C |
|
Coefficient of Thermal Expansion |
~ 19.1 × 10⁻⁶ /°C |
|
Tensile Strength (σᵦ) |
~ 290 – 570 MPa (varies by temper) |
|
Elongation (A, % ) |
~ 3 % up to 45 % (depending on temper) |
|
Hardness (HV) |
~ 55 – 190 |
|
Thickness Range |
0.2 mm – ~150 mm (or custom) |
|
Width / Length |
Customizable per customer order |
|
Surface Finishes |
Mill/annealed, polished, mirror, brushed, coated |
Features of H65 Copper Plate
Excellent Formability and Machinability
H65 Copper Plate, containing approximately 65% copper and 35% zinc, offers outstanding cold and hot workability, allowing easy forming, stamping, and machining for complex industrial parts.
High Strength with Good Ductility
Combining a tensile strength of up to 570 MPa with balanced elongation, H65 provides superior mechanical performance suitable for both structural and decorative applications.
Reliable Corrosion and Wear Resistance
The alloy's stable copper-zinc composition ensures strong resistance to atmospheric and freshwater corrosion, making it ideal for long-term use in humid or industrial environments.
Superior Conductivity and Thermal Performance
With approximately 32% IACS electrical conductivity and high thermal transfer efficiency, H65 brass plate is widely used in radiators, connectors, and heat exchange equipment.
Hot Tags: h65 copper plate, China h65 copper plate manufacturers, suppliers, factory, C7025 Brass Plate, copper alloy, copper alloy plate, H65 Copper Plate, H68 Brass Plate
